EMC of Semiconductor Packages. EMI Evaluation of Semiconductor Packages.
نویسندگان
چکیده
منابع مشابه
Modified single cantilever adhesion test for EMC/PSR interface in thin semiconductor packages
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ژورنال
عنوان ژورنال: Journal of Japan Institute of Electronics Packaging
سال: 1998
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.1.446